Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications
Advanced Nanoscale ULSI Interconnects: Fundamental and Applications brings a comprehensive description of copper based interconnect technology for Ultra Large Scale Integration (ULSI) technology to Integrated Circuit (ICs) application. This book reviews the basic technologies used today for the copp...
Corporate Author: | SpringerLink (Online service) |
---|---|
Other Authors: | Shacham-Diamand, Yosi. (Editor), Osaka, Tetsuya. (Editor), Datta, Madhav. (Editor), Ohba, Takayuki. (Editor) |
Format: | Electronic |
Language: | English |
Published: |
New York, NY :
Springer New York,
2009.
|
Subjects: | |
Online Access: | View fulltext via EzAccess |
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