Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications

• Corporate Author: SpringerLink (Online service)
• Other Authors: Shacham-Diamand, Yosi. (Editor), Osaka, Tetsuya. (Editor), Datta, Madhav. (Editor), Ohba, Takayuki. (Editor)
• Format: Electronic
• Language: English
• Published: New York, NY : Springer New York, 2009.
• Subjects: Chemistry.; Chemical engineering.; Computer engineering.; Materials.; Nanotechnology.; Electrochemistry.; Materials Science, general.; Industrial Chemistry/Chemical Engineering.; Electrical Engineering.
• Online Access: View fulltext via EzAccess

Advanced Nanoscale ULSI Interconnects: Fundamental and Applications brings a comprehensive description of copper based interconnect technology for Ultra Large Scale Integration (ULSI) technology to Integrated Circuit (ICs) application. This book reviews the basic technologies used today for the copp...

Table of Contents:

• Introduction
• Technology Background
• Interconnect Materials
• Deposition Processes for ULSI Interconnects
• Modeling
• Electrochemical Process Integration
• Electrochemical Processes and Tools
• Metrology
• Summary and Foresight.