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100301s2009 xxu| s |||| 0|eng d |
| 020 |
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|a 9780387958682
|9 978-0-387-95868-2
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| 024 |
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|a 10.1007/978-0-387-95868-2
|2 doi
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|a QD551-578
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|a PNRH
|2 bicssc
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|a SCI013050
|2 bisacsh
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|a 541.37
|2 23
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| 100 |
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|a Shacham-Diamand, Yosi.
|e editor.
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| 245 |
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|a Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications
|c edited by Yosi Shacham-Diamand, Tetsuya Osaka, Madhav Datta, Takayuki Ohba.
|h [electronic resource] /
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| 264 |
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1 |
|a New York, NY :
|b Springer New York,
|c 2009.
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| 300 |
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|b online resource.
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| 336 |
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|a text
|b txt
|2 rdacontent
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| 337 |
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|a computer
|b c
|2 rdamedia
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| 338 |
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|a online resource
|b cr
|2 rdacarrier
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| 347 |
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|a text file
|b PDF
|2 rda
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| 505 |
0 |
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|a Introduction -- Technology Background -- Interconnect Materials -- Deposition Processes for ULSI Interconnects -- Modeling -- Electrochemical Process Integration -- Electrochemical Processes and Tools -- Metrology -- Summary and Foresight.
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| 520 |
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|a Advanced Nanoscale ULSI Interconnects: Fundamental and Applications brings a comprehensive description of copper based interconnect technology for Ultra Large Scale Integration (ULSI) technology to Integrated Circuit (ICs) application. This book reviews the basic technologies used today for the copper metallization of ULSI applications: deposition and planarization. It describes the materials used, their properties, and the way they are all integrated, specifically in regard to the copper integration processes and electrochemical processes in the nanoscale regime. The book also presents various novel nanoscale technologies that will link modern nanoscale electronics to future nanoscale based systems. This diverse, multidisciplinary volume will appeal to process engineers in the microelectronics industry; universities with programs in ULSI design, microelectronics, MEMS and nanoelectronics; and professionals in the electrochemical industry working with materials, plating and tool vendors.
|
| 650 |
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0 |
|a Chemistry.
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| 650 |
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|a Chemical engineering.
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| 650 |
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|a Computer engineering.
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| 650 |
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|a Materials.
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| 650 |
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|a Nanotechnology.
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| 650 |
1 |
4 |
|a Chemistry.
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| 650 |
2 |
4 |
|a Electrochemistry.
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| 650 |
2 |
4 |
|a Materials Science, general.
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| 650 |
2 |
4 |
|a Industrial Chemistry/Chemical Engineering.
|
| 650 |
2 |
4 |
|a Electrical Engineering.
|
| 650 |
2 |
4 |
|a Nanotechnology.
|
| 700 |
1 |
# |
|a Osaka, Tetsuya.
|e editor.
|
| 700 |
1 |
# |
|a Datta, Madhav.
|e editor.
|
| 700 |
1 |
# |
|a Ohba, Takayuki.
|e editor.
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| 710 |
2 |
# |
|a SpringerLink (Online service)
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| 773 |
0 |
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|t Springer eBooks
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| 776 |
0 |
8 |
|i Printed edition:
|z 9780387958675
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| 856 |
4 |
0 |
|z View fulltext via EzAccess
|u https://ezaccess.library.uitm.edu.my/login?url=http://dx.doi.org/10.1007/978-0-387-95868-2
|
| 912 |
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|a ZDB-2-CMS
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| 950 |
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|a Chemistry and Materials Science (Springer-11644)
|