Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications

Advanced Nanoscale ULSI Interconnects: Fundamental and Applications brings a comprehensive description of copper based interconnect technology for Ultra Large Scale Integration (ULSI) technology to Integrated Circuit (ICs) application. This book reviews the basic technologies used today for the copp...

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Bibliographic Details
Corporate Author: SpringerLink (Online service)
Other Authors: Shacham-Diamand, Yosi. (Editor), Osaka, Tetsuya. (Editor), Datta, Madhav. (Editor), Ohba, Takayuki. (Editor)
Format: Electronic
Language:English
Published: New York, NY : Springer New York, 2009.
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Online Access:View fulltext via EzAccess