Advanced Wirebond Interconnection Technology
Advanced Wire Bond Interconnection Technology addresses wire bonding from both manufacturing and reliability perspectives. It analyzes and explores the various factors that one needs to consider: design, materials, processing, equipment, quality testing and reliability engineering, and last but not...
Main Author: | Prasad, Shankara K. (Author) |
---|---|
Corporate Author: | SpringerLink (Online service) |
Format: | Electronic |
Language: | English |
Published: |
Boston, MA :
Springer US,
2004.
|
Subjects: | |
Online Access: | View fulltext via EzAccess |
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