Advanced Wirebond Interconnection Technology

Advanced Wire Bond Interconnection Technology addresses wire bonding from both manufacturing and reliability perspectives. It analyzes and explores the various factors that one needs to consider: design, materials, processing, equipment, quality testing and reliability engineering, and last but not...

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Bibliographic Details
Main Author: Prasad, Shankara K. (Author)
Corporate Author: SpringerLink (Online service)
Format: Electronic
Language:English
Published: Boston, MA : Springer US, 2004.
Subjects:
Online Access:View fulltext via EzAccess
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505 0 # |a Materials for Wire Bonding -- Bonding Equipment -- Process Technology -- Quality -- Reliability -- New Technologies and New Applications for Wire Bonding. 
520 # # |a Advanced Wire Bond Interconnection Technology addresses wire bonding from both manufacturing and reliability perspectives. It analyzes and explores the various factors that one needs to consider: design, materials, processing, equipment, quality testing and reliability engineering, and last but not the least, operator training. This book is intended to be a comprehensive source of information and knowledge that enables both a newcomer to the field and a veteran who needs instant information to make a decision on a process problem. The book explains not only how to do things such as: designing a bond pad or a lead finger, how to select a right bond wire, how to design a capillary and how to optimize a bonding process on the factory floor; but the book also explains why to do it that way. 
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650 # 0 |a Machines. 
650 # 0 |a Tools. 
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650 # 0 |a Optical materials. 
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650 2 4 |a Electronics and Microelectronics, Instrumentation. 
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650 2 4 |a Optical and Electronic Materials. 
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