Advanced Wirebond Interconnection Technology

• Main Author: Prasad, Shankara K. (Author)
• Corporate Author: SpringerLink (Online service)
• Format: Electronic
• Language: English
• Published: Boston, MA : Springer US, 2004.
• Subjects: Engineering.; Manufacturing industries.; Machines.; Tools.; Electronics.; Microelectronics.; Electronic circuits.; Optical materials.; Electronic materials.; Manufacturing, Machines, Tools.; Electronics and Microelectronics, Instrumentation.; Circuits and Systems.; Optical and Electronic Materials.
• Online Access: View fulltext via EzAccess

Advanced Wire Bond Interconnection Technology addresses wire bonding from both manufacturing and reliability perspectives. It analyzes and explores the various factors that one needs to consider: design, materials, processing, equipment, quality testing and reliability engineering, and last but not...

Table of Contents:

• Materials for Wire Bonding
• Bonding Equipment
• Process Technology
• Quality
• Reliability
• New Technologies and New Applications for Wire Bonding.