Advanced Wirebond Interconnection Technology

Advanced Wire Bond Interconnection Technology addresses wire bonding from both manufacturing and reliability perspectives. It analyzes and explores the various factors that one needs to consider: design, materials, processing, equipment, quality testing and reliability engineering, and last but not...

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Bibliographic Details
Main Author: Prasad, Shankara K. (Author)
Corporate Author: SpringerLink (Online service)
Format: Electronic
Language:English
Published: Boston, MA : Springer US, 2004.
Subjects:
Online Access:View fulltext via EzAccess