RF and Microwave Microelectronics Packaging
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in...
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| Other Authors: | , , |
| Format: | Electronic |
| Language: | English |
| Published: |
Boston, MA :
Springer US,
2010.
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| Subjects: | |
| Online Access: | https://ezaccess.library.uitm.edu.my/login?url=http://dx.doi.org/10.1007/978-1-4419-0984-8 |