RF and Microwave Microelectronics Packaging

• Corporate Author: SpringerLink (Online service)
• Other Authors: Kuang, Ken. (Editor), Kim, Franklin. (Editor), Cahill, Sean S. (Editor)
• Format: Electronic
• Language: English
• Published: Boston, MA : Springer US, 2010.
• Subjects: Engineering.; Microwaves.; Electronics.; Systems engineering.; Electronics and Microelectronics, Instrumentation.; Microwaves, RF and Optical Engineering.; Circuits and Systems.
• Online Access: https://ezaccess.library.uitm.edu.my/login?url=http://dx.doi.org/10.1007/978-1-4419-0984-8

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in...

Table of Contents:

• Fundamentals of packaging at microwave and millimeter-wave frequencies
• Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages
• Polymeric Microelectromechanical Millimeter Wave Systems
• Millimeter-Wave Chip-on-Board Integration and Packaging
• Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer Hermetic Packages and Modules
• RF/Microwave Substrate Packaging Roadmap for Portable Devices
• Ceramic systems in package for RF and microwave
• Low-Temperature Cofired-Ceramic Laminate Waveguides for mmWave Applications
• LTCC Substrates For RF/MW Application
• High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging
• High Performance Microelectronics Packaging Heat Sink Materials
• Technology Research on AlN 3D MCM.