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Three-dimensional integration and modeling a revolution in RF and wireless packaging /

This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band tr...

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Bibliographic Details
Main Author: Lee, Jong-Hoon.
Other Authors: Tentzeris, Manos M.
Format: Electronic
Language:English
Published: San Rafael, Calif. (1537 Fourth Street, San Rafael, CA 94901 USA) : Morgan & Claypool Publishers, c2008.
Series:Synthesis lectures on computational electromagnetics (Online), #17.
Subjects:
Microelectronic packaging.
Millimeter wave communication systems.
Wireless communication systems.
Online Access:Abstract with links to full text
Table of Contents:
  • Abstract
  • Keywords
  • 1. Introduction
  • 2. Background on technologies for millimeter-wave passive front-ends
  • 2.1. 3D Integrated SOP concept
  • 2.2. LTCC multilayer technology
  • 2.3. 60 GHz transmitter/receiver modules
  • 3. Three-dimensional packaging in multilayer organic substrates
  • 3.1. Multilayer LCP substrates
  • 3.2. RF MEMS packaging using multilayer LCP substrates
  • 3.3. Active device packaging using multilayer LCP substrates
  • 3.4. Three-dimensional paper-based modules for RFID/sensing applications
  • 4. Microstrip-type integrated passives
  • 4.1. Patch resonator filters and duplexers
  • 4.2. Quasielliptic filter
  • 5. Cavity-type integrated passives
  • 5.1. Rectangular cavity resonator
  • 5.2. Three-pole cavity filters
  • 5.3. Vertically stacked cavity filters and duplexers
  • 5.4. Cavity-based dual-mode filters
  • 6. Three-dimensional antenna architectures
  • 6.1. Patch antenna using a soft-surface structure
  • 6.2. High-gain patch antenna using soft-surface structure and stacked cavity
  • 6.3. Dual-polarized cross-shaped microstrip antenna
  • 6.4. Series-fed antenna array
  • 7. Fully integrated three-dimensional passive front-ends
  • 7.1. Passive front-ends for 60 GHz time-division duplexing (TDD) applications
  • 7.2. Passive front-ends for 60 GHz frequency-division duplexing applications
  • References.

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