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Three-dimensional integration and modeling a revolution in RF and wireless packaging /

This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band tr...

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Bibliographic Details
Main Author: Lee, Jong-Hoon.
Other Authors: Tentzeris, Manos M.
Format: Electronic
Language:English
Published: San Rafael, Calif. (1537 Fourth Street, San Rafael, CA 94901 USA) : Morgan & Claypool Publishers, c2008.
Series:Synthesis lectures on computational electromagnetics (Online), #17.
Subjects:
Microelectronic packaging.
Millimeter wave communication systems.
Wireless communication systems.
Online Access:Abstract with links to full text
LEADER 04716nam a2200721 a 4500
001 3269
005 20081106194139.0
006 m e d
007 cr cn |||m|||a
008 081019s2008 caua fsb 000 0 eng d
020 # # |a 1598292455 (electronic bk.) 
020 # # |a 9781598292459 (electronic bk.) 
020 # # |a 1598292447 (pbk.) 
020 # # |a 9781598292442 (pbk.) 
024 7 # |a 10.2200/S00080ED1V01Y200710CEM017  |2 doi 
035 # # |a (OCoLC)191100736 
035 # # |a (CaBNvSL)gtp00531437 
040 # # |a CaBNvSL  |c CaBNvSL  |d CaBNvSL 
050 # 4 |a TK7870.15  |b L447 2008 
082 0 4 |a 621.381046  |2 22 
100 1 # |a Lee, Jong-Hoon. 
245 1 0 |a Three-dimensional integration and modeling  |b a revolution in RF and wireless packaging /  |c Jong-Hoon Lee, Manos M. Tentzeris.  |h [electronic resource] : 
260 # # |a San Rafael, Calif. (1537 Fourth Street, San Rafael, CA 94901 USA) :  |b Morgan & Claypool Publishers,  |c c2008. 
300 # # |a 1 electronic text (x, 108 p. : ill. (some col.)) :  |b digital file. 
490 1 # |a Synthesis lectures on computational electromagnetics,  |v #17  |x 1932-1716 ; 
500 # # |a Part of: Synthesis digital library of engineering and computer science. 
500 # # |a Title from PDF t.p. (viewed Oct. 19, 2008). 
500 # # |a Series from website. 
504 # # |a Includes bibliographical references (p. 99-106). 
505 0 # |a Abstract -- Keywords -- 1. Introduction -- 2. Background on technologies for millimeter-wave passive front-ends -- 2.1. 3D Integrated SOP concept -- 2.2. LTCC multilayer technology -- 2.3. 60 GHz transmitter/receiver modules -- 3. Three-dimensional packaging in multilayer organic substrates -- 3.1. Multilayer LCP substrates -- 3.2. RF MEMS packaging using multilayer LCP substrates -- 3.3. Active device packaging using multilayer LCP substrates -- 3.4. Three-dimensional paper-based modules for RFID/sensing applications -- 4. Microstrip-type integrated passives -- 4.1. Patch resonator filters and duplexers -- 4.2. Quasielliptic filter -- 5. Cavity-type integrated passives -- 5.1. Rectangular cavity resonator -- 5.2. Three-pole cavity filters -- 5.3. Vertically stacked cavity filters and duplexers -- 5.4. Cavity-based dual-mode filters -- 6. Three-dimensional antenna architectures -- 6.1. Patch antenna using a soft-surface structure -- 6.2. High-gain patch antenna using soft-surface structure and stacked cavity -- 6.3. Dual-polarized cross-shaped microstrip antenna -- 6.4. Series-fed antenna array -- 7. Fully integrated three-dimensional passive front-ends -- 7.1. Passive front-ends for 60 GHz time-division duplexing (TDD) applications -- 7.2. Passive front-ends for 60 GHz frequency-division duplexing applications -- References. 
506 # # |a Abstract freely available; full-text restricted to subscribers or individual document purchasers. 
510 0 # |a Compendex 
510 0 # |a INSPEC 
510 0 # |a Google scholar 
510 0 # |a Google book search 
520 # # |a This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules. 
530 # # |a Also available in print. 
538 # # |a Mode of access: World Wide Web. 
538 # # |a System requirements: Adobe Acrobat reader. 
650 # 0 |a Microelectronic packaging. 
650 # 0 |a Millimeter wave communication systems. 
650 # 0 |a Wireless communication systems. 
690 # # |a Three dimensional integration. 
690 # # |a Bandpass filter. 
690 # # |a Antenna. 
690 # # |a Low-temperature co-fired ceramic. 
690 # # |a Liquid crystal polymer organics. 
690 # # |a Ceramics. 
690 # # |a Soft surfaces. 
690 # # |a Front-end modules. 
690 # # |a Front-end module. 
690 # # |a Transceiver. 
690 # # |a Patch resonator. 
690 # # |a Gigabit. 
690 # # |a Dual-mode. 
690 # # |a Cavity. 
690 # # |a Millimeter wave. 
690 # # |a V-band. 
690 # # |a 60 GHz. 
700 1 # |a Tentzeris, Manos M. 
730 0 # |a Synthesis digital library of engineering and computer science. 
830 # 0 |a Synthesis lectures on computational electromagnetics (Online),  |v #17.  |x 1932-1716 ; 
856 4 2 |u https://ezaccess.library.uitm.edu.my/login?url=http://dx.doi.org/10.2200/S00080ED1V01Y200710CEM017  |3 Abstract with links to full text 

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