Three-dimensional integration and modeling a revolution in RF and wireless packaging /
This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band tr...
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Electronic |
| Language: | English |
| Published: |
San Rafael, Calif. (1537 Fourth Street, San Rafael, CA 94901 USA) :
Morgan & Claypool Publishers,
c2008.
|
| Series: | Synthesis lectures on computational electromagnetics (Online),
#17. |
| Subjects: | |
| Online Access: | Abstract with links to full text |