Three-dimensional integration and modeling a revolution in RF and wireless packaging /

• Main Author: Lee, Jong-Hoon.
• Other Authors: Tentzeris, Manos M.
• Format: Electronic
• Language: English
• Published: San Rafael, Calif. (1537 Fourth Street, San Rafael, CA 94901 USA) : Morgan & Claypool Publishers, c2008.
• Series: Synthesis lectures on computational electromagnetics (Online), #17.
• Subjects: Microelectronic packaging.; Millimeter wave communication systems.; Wireless communication systems.
• Online Access: Abstract with links to full text
• Item Description: Part of: Synthesis digital library of engineering and computer science.; Title from PDF t.p. (viewed Oct. 19, 2008).; Series from website.
• Physical Description: 1 electronic text (x, 108 p. : ill. (some col.)) : digital file.; Also available in print.
• Format: Mode of access: World Wide Web.; System requirements: Adobe Acrobat reader.
• Bibliography: Includes bibliographical references (p. 99-106).
• ISBN: 1598292455 (electronic bk.); 9781598292459 (electronic bk.); 1598292447 (pbk.); 9781598292442 (pbk.)
• ISSN: 1932-1716
• Access: Abstract freely available; full-text restricted to subscribers or individual document purchasers.

This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules.