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Advanced Ta-based diffusion barriers for Cu interconnects

Bibliographic Details
Main Author:	Hübner, René.
Format:	Electronic
Language:	English
Published:	New York : Nova Science Publishers, c2009.
Subjects:	Interconnects (Integrated circuit technology) Integrated circuits. Electrodiffusion. TECHNOLOGY & ENGINEERING > Circuits > Integrated. > Electronics TECHNOLOGY & ENGINEERING > Circuits > General. > Electronics Electronic books.
Online Access:	View fulltext via EzAccess

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