Advanced Ta-based diffusion barriers for Cu interconnects
Main Author: | |
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Format: | Electronic |
Language: | English |
Published: |
New York :
Nova Science Publishers,
c2009.
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Subjects: | |
Online Access: | View fulltext via EzAccess |
Physical Description: | 1 online resource (93 p.) : ill. |
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Bibliography: | Includes bibliographical references (p. [73]-86) and index. |
ISBN: | 9781607416753 (electronic bk.) 1607416751 (electronic bk.) |