Advanced MEMS packaging
| Other Authors: | |
|---|---|
| Format: | Electronic |
| Language: | English |
| Published: |
New York :
McGraw-Hill,
c2010.
|
| Subjects: | |
| Online Access: | Books24x7 ebrary View fulltext via EzAccess McGraw-Hill MyiLibrary |
| LEADER | 03487cam a2200673Ia 4500 | ||
|---|---|---|---|
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| 003 | OCoLC | ||
| 005 | 20130711002247.0 | ||
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| 007 | cr cn| | ||
| 008 | 100317s2010 nyua ob 001 0 eng d | ||
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| 245 | 0 | 0 | |a Advanced MEMS packaging |c John H. Lau ... [et al.]. |h [electronic resource] / |
| 246 | 3 | # | |a Advanced microelectromechanical systems packaging |
| 260 | # | # | |a New York : |b McGraw-Hill, |c c2010. |
| 300 | # | # | |a 1 online resource (xxiii, 552 p.) : |b ill. |
| 504 | # | # | |a Includes bibliographical references and index. |
| 505 | 0 | # | |a Introduction to MEMS -- Advanced MEMS packaging -- Enabling technologies for advanced MEMS packaging -- Advanced MEMS wafer-level packaging -- Optical MEMS packaging : communications -- Optical MEMS packaging : bubble switch -- Optical MEMS : microbolometer packaging -- Bio-MEMS packaging -- Biosensor packaging -- Accelerometer packaging -- Radiofrequency MEMS switches -- RF MEMS tunable capacitors and tubable band-pass filters -- Advanced packaging of RF MEMS devices. |
| 588 | # | # | |a Description based on print version record. |
| 650 | # | 0 | |a Microelectromechanical systems. |
| 650 | # | 0 | |a Microelectronic packaging. |
| 650 | # | 7 | |a TECHNOLOGY & ENGINEERING |x Microelectronics. |x Electronics |2 bisacsh |
| 650 | # | 7 | |a TECHNOLOGY & ENGINEERING |x Digital. |x Electronics |2 bisacsh |
| 655 | # | 7 | |a Electronic books. |2 local |
| 655 | # | 4 | |a Electronic books. |
| 700 | 1 | # | |a Lau, John H. |
| 776 | 0 | 8 | |d New York : McGraw-Hill, c2010 |i Print version: |t Advanced MEMS packaging. |w (OCoLC)277205716 |w (DLC) 2009040456 |z 9780071626231 |
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