Holdings: Advanced MEMS packaging

Bibliographic Details
Other Authors:	Lau, John H.
Format:	Electronic
Language:	English
Published:	New York : McGraw-Hill, c2010.
Subjects:	Microelectromechanical systems. Microelectronic packaging. TECHNOLOGY & ENGINEERING > Microelectronics. > Electronics TECHNOLOGY & ENGINEERING > Digital. > Electronics Electronic books.
Online Access:	Books24x7 ebrary View fulltext via EzAccess McGraw-Hill MyiLibrary

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