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topic_facet:"Microelectronic packaging"
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Microelectronic packaging
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Three-dimensional integration and modeling a revolution in RF and wireless packaging /
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Lee, Jong-Hoon.
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Advanced MEMS packaging
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Suggested Topics: Microelectronic packaging
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T - Technology
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Author
Lau, John H.
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Lee, Jong-Hoon
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Tentzeris, Manos M.
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