Solder Joint Reliability Prediction for Multiple Environments
Solder Joint Reliability Prediction for Multiple Environments provides industry engineers, graduate students, academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. Th...
| Main Authors: | , |
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| Corporate Author: | |
| Format: | Electronic |
| Language: | English |
| Published: |
Boston, MA :
Springer US,
2009.
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| Subjects: | |
| Online Access: | https://ezaccess.library.uitm.edu.my/login?url=http://dx.doi.org/10.1007/978-0-387-79394-8 |