Materials for Advanced Packaging

• Corporate Author: SpringerLink (Online service)
• Other Authors: Lu, Daniel. (Editor), Wong, C.P. (Editor)
• Format: Electronic
• Language: English
• Published: Boston, MA : Springer US, 2009.
• Subjects: Electronics.; Optical materials.; Nanotechnology.; Materials.; Materials Science.; Optical and Electronic Materials.; Metallic Materials.; Electronics and Microelectronics, Instrumentation.
• Online Access: https://ezaccess.library.uitm.edu.my/login?url=http://dx.doi.org/10.1007/978-0-387-78219-5

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. Materials for Advanced Packaging provides a comprehensive review on the most recent developments in advanced packaging tech...

Table of Contents:

• Materials for 3D Packages
• Materials for Advanced Bonding/ Joining Techniques
• Materials for Advanced Interconnections
• Lead-Free Solders
• Materials for Wafer Processing (such as thinning)
• Materials for Advanced Substrates (such as thin core or coreless substrates)
• Materials for Advanced Underfill and Encapsulant
• Adhesives (ECA, Nano-ECA, Die Attach Adhesive)
• Advanced Thermal Interface Materials
• Materials for Embedded Passives
• Nanomaterials/ Nanopackaging
• Wafer Level Packaging
• MEMS Packaging
• Optical Packaging
• Digital Health and Biomedical Packaging.