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100301s2009 xxu| s |||| 0|eng d |
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|a 9780387782195
|9 978-0-387-78219-5
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|a 10.1007/978-0-387-78219-5
|2 doi
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|a TA1750-1750.22
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|a TJFD
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|a 620.11295
|2 23
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|a 620.11297
|2 23
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| 100 |
1 |
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|a Lu, Daniel.
|e editor.
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| 245 |
1 |
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|a Materials for Advanced Packaging
|c edited by Daniel Lu, C.P. Wong.
|h [electronic resource] /
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| 264 |
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1 |
|a Boston, MA :
|b Springer US,
|c 2009.
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| 300 |
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|b online resource.
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| 336 |
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|a text
|b txt
|2 rdacontent
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|a computer
|b c
|2 rdamedia
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| 338 |
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|a online resource
|b cr
|2 rdacarrier
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| 347 |
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|a text file
|b PDF
|2 rda
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|a Materials for 3D Packages -- Materials for Advanced Bonding/ Joining Techniques -- Materials for Advanced Interconnections -- Lead-Free Solders -- Materials for Wafer Processing (such as thinning) -- Materials for Advanced Substrates (such as thin core or coreless substrates) -- Materials for Advanced Underfill and Encapsulant -- Adhesives (ECA, Nano-ECA, Die Attach Adhesive) -- Advanced Thermal Interface Materials -- Materials for Embedded Passives -- Nanomaterials/ Nanopackaging -- Wafer Level Packaging -- MEMS Packaging -- Optical Packaging -- Digital Health and Biomedical Packaging.
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| 520 |
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|a Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. Materials for Advanced Packaging provides a comprehensive review on the most recent developments in advanced packaging technologies including emerging technologies such as 3 dimensional (3D), nanopackaging, and biomedical packaging with a focus on materials and processing aspects. This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging including: New bonding and joining techniques Novel approaches to make electrical interconnects between integrated circuit (IC) and substrates Latest advances in packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives. Materials and processing aspects on MEMS and wafer level chip scale packaging. Written by experts in the field of materials and packaging, Materials for Advanced Packaging is a must have book for professionals in semiconductor, digital health and bio-medical areas, and graduate students studying materials science and engineering.
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| 650 |
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0 |
|a Electronics.
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| 650 |
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0 |
|a Optical materials.
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| 650 |
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0 |
|a Nanotechnology.
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| 650 |
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0 |
|a Materials.
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| 650 |
1 |
4 |
|a Materials Science.
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| 650 |
2 |
4 |
|a Optical and Electronic Materials.
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| 650 |
2 |
4 |
|a Metallic Materials.
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| 650 |
2 |
4 |
|a Nanotechnology.
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| 650 |
2 |
4 |
|a Electronics and Microelectronics, Instrumentation.
|
| 700 |
1 |
# |
|a Wong, C.P.
|e editor.
|
| 710 |
2 |
# |
|a SpringerLink (Online service)
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| 773 |
0 |
# |
|t Springer eBooks
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| 776 |
0 |
8 |
|i Printed edition:
|z 9780387782188
|
| 856 |
4 |
0 |
|u https://ezaccess.library.uitm.edu.my/login?url=http://dx.doi.org/10.1007/978-0-387-78219-5
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| 912 |
# |
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|a ZDB-2-CMS
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| 950 |
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|a Chemistry and Materials Science (Springer-11644)
|