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| LEADER |
00617nam a2200145Ia 4500 |
| 001 |
31773 |
| 005 |
20163228946 |
| 008 |
160422s9999 xx 000 0 und d |
| 020 |
# |
# |
|a 9780080492247 (eBook)
|
| 100 |
1 |
0 |
|a Lee, Ning-Cheng.
|
| 245 |
1 |
0 |
|a Reflow Soldering Processes
|b SMT, BGA, CSP and flip chip technologies
|c Lee, Ning-Cheng
|h [electronic resource]
|
| 260 |
# |
# |
|a Boston
|b Newnes
|c 2002
|
| 300 |
# |
# |
|a 1 online resource
|
| 650 |
# |
0 |
|a Electronic apparatus and appliances
|x Design and construction
|
| 856 |
4 |
0 |
|u https://ezaccess.library.uitm.edu.my/login?url=http://www.sciencedirect.com/science/book/9780750672184
|z View fulltext via EZaccess
|