APA Citation

Lee, N. (2002). Reflow Soldering Processes: SMT, BGA, CSP and flip chip technologies. Boston: Newnes.

Chicago Style Citation

Lee, Ning-Cheng. Reflow Soldering Processes: SMT, BGA, CSP and Flip Chip Technologies. Boston: Newnes, 2002.

MLA Citation

Lee, Ning-Cheng. Reflow Soldering Processes: SMT, BGA, CSP and Flip Chip Technologies. Boston: Newnes, 2002.

Warning: These citations may not always be 100% accurate.