Electromigration Modeling at Circuit Layout Level
Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels.� Electromigration (EM) of interconnects has...
Main Authors: | Tan, Cher Ming. (Author), He, Feifei. (Author) |
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Corporate Author: | SpringerLink (Online service) |
Format: | Electronic |
Language: | English |
Published: |
Singapore :
Springer Singapore : Imprint: Springer,
2013.
|
Series: | SpringerBriefs in Applied Sciences and Technology,
|
Subjects: | |
Online Access: | https://ezaccess.library.uitm.edu.my/login?url=http://dx.doi.org/10.1007/978-981-4451-21-5 |
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