Electromigration Modeling at Circuit Layout Level

Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels.� Electromigration (EM) of interconnects has...

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Bibliographic Details
Main Authors: Tan, Cher Ming. (Author), He, Feifei. (Author)
Corporate Author: SpringerLink (Online service)
Format: Electronic
Language:English
Published: Singapore : Springer Singapore : Imprint: Springer, 2013.
Series:SpringerBriefs in Applied Sciences and Technology,
Subjects:
Online Access:https://ezaccess.library.uitm.edu.my/login?url=http://dx.doi.org/10.1007/978-981-4451-21-5