Factors Governing Tin Whisker Growth

• Main Author: Crandall, Erika R. (Author)
• Corporate Author: SpringerLink (Online service)
• Format: Electronic
• Language: English
• Published: Cham : Springer International Publishing : Imprint: Springer, 2013.
• Series: Springer Theses, Recognizing Outstanding Ph.D. Research,
• Subjects: Physics.; Systems engineering.; Materials.; Surfaces (Physics).; Electronic Circuits and Devices.; Circuits and Systems.; Metallic Materials.; Surfaces and Interfaces, Thin Films.; Surface and Interface Science, Thin Films.
• Online Access: https://ezaccess.library.uitm.edu.my/login?url=http://dx.doi.org/10.1007/978-3-319-00470-9

Tin (Sn) whiskers are electrically conductive, single crystal eruptions that grow from Sn film surfaces. Their high aspect ratio presents reliability problems for the electronics industry due to bridging and metal arcing, leading to malfunctions and catastrophic failures in many electronic systems (...

Table of Contents:

• Whiskers and Their Role in Component Reliability
• Film/Substrate Effects on Whisker Growth
• Environmental Effects of Whisker Growth
• Whisker Mitigation and Prevention
• Conclusions.