Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
This book describes the design of through-silicon-via (TSV) based three-dimensional integrated circuits.� It includes details of numerous manufacturing-ready GDSII-level layouts of TSV-based 3D ICs, developed with tools covered in the book. Readers will benefit from the sign-off level analysis of...
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| Format: | Electronic |
| Language: | English |
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New York, NY :
Springer New York : Imprint: Springer,
2013.
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| Online Access: | https://ezaccess.library.uitm.edu.my/login?url=http://dx.doi.org/10.1007/978-1-4419-9542-1 |
Table of Contents:
- Regular vs Irregular TSV Placementfor 3D IC
- Steiner Routingfor 3D IC
- Buffer Insertion for�3D IC.-��Low Power Clock Routing for 3D IC
- Power Delivery Network Design for 3D IC
- 3D Clock Routing for Pre-bond Testability
- TSV-to-TSV Coupling Analysis and Optimization
- TSV Current Crowding and Power Integrity
- Modeling of Atomic Concentration at the Wire-to-TSV Interface
- Multi-Objective Archetectural Floorplanning for 3D IC
- Thermal-aware Gate-level Placement for 3D IC
- 3D IC Cooling with Micro-Fluidic Channels
- Mechanical Reliability Analysis and Optimization for 3D IC
- Impact of Mechanical Stress on Timing Variation for 3D IC
- Chip/Package Co-Analysis of Mechanical Stress for 3D IC
- 3D Chip/Packaging Co-Analysis of Stress-Induced Timing Variations
- TSV Interfracial Crack Analysis and Optimization
- Ultra High Logic Designs Using Monolithic 3D Integration
- Impact of TSV Scaling on 3D IC Design Quality
- 3D-MAPS: 3DMassively Parallel Processor with Stacked Memory.