Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
This book describes the design of through-silicon-via (TSV) based three-dimensional integrated circuits.� It includes details of numerous manufacturing-ready GDSII-level layouts of TSV-based 3D ICs, developed with tools covered in the book. Readers will benefit from the sign-off level analysis of...
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| Format: | Electronic |
| Language: | English |
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New York, NY :
Springer New York : Imprint: Springer,
2013.
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| Online Access: | https://ezaccess.library.uitm.edu.my/login?url=http://dx.doi.org/10.1007/978-1-4419-9542-1 |