Coupled Data Communication Techniques for High-Performance and Low-Power Computing

• Corporate Author: SpringerLink (Online service)
• Other Authors: Ho, Ron. (Editor), Drost, Robert. (Editor)
• Format: Electronic
• Language: English
• Published: Boston, MA : Springer US, 2010.
• Series: Integrated Circuits and Systems,
• Subjects: Engineering.; Computer hardware.; Computer engineering.; Electronics.; Systems engineering.; Circuits and Systems.; Electronics and Microelectronics, Instrumentation.; Electrical Engineering.; Computer Hardware.
• Online Access: https://ezaccess.library.uitm.edu.my/login?url=http://dx.doi.org/10.1007/978-1-4419-6588-2

Designers of next-generation high-performance computer systems face a host of technical challenges. For the past several decades, rising clock frequencies and increased chip integration have fueled the growth of computer performance. Now these trends have slowed: power and complexity constrains furt...

Table of Contents:

• Introduction to Coupled Data Technologies
• Power delivery, signaling and cooling for 2D and 3D integrated systems
• Capacitive Coupled Communication
• Inductive Coupled Communications
• Use of AC Coupled Interconnect in Contactless Packaging
• Aligning chips face-to-face for dense capacitive communication
• Delivering On-chip Bandwidth Off-chip and Out-of-box with Proximity and Optical Communication
• AC Coupled Wireless Power Delivery.