Copper Interconnect Technology

• Main Author: Gupta, Tapan. (Author)
• Corporate Author: SpringerLink (Online service)
• Format: Electronic
• Language: English
• Published: New York, NY : Springer New York : Imprint: Springer, 2009.
• Subjects: Engineering.; Electronics.; Systems engineering.; Optical materials.; Nanotechnology.; Electronics and Microelectronics, Instrumentation.; Optical and Electronic Materials.; Circuits and Systems.
• Online Access: https://ezaccess.library.uitm.edu.my/login?url=http://dx.doi.org/10.1007/978-1-4419-0076-0

Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. During the last decade, however, the parasitic resistance, capacitance, and inductance associated with interconnections began t...

Table of Contents:

• Introduction
• Dielectric Materials
• Diffusion and Barrier Layer
• Pattern Generation
• Deposition Technologies of Materials for Cu-interconnects
• Copper Damascene Process and Chemical Mechanical Polishing
• Conduction and Electromigration (EM)
• Routing and Reliability.