Optical interconnects

• Main Author: Chen, Ray T.
• Other Authors: Choi, Chulchae.
• Format: Electronic
• Language: English
• Published: San Rafael, Calif. (1537 Fourth Street, San Rafael, CA 94901 USA) : Morgan & Claypool Publishers, c2007.
• Edition: 1st ed.
• Series: Synthesis lectures on solid state materials and devices (Online), #2.
• Subjects: Optical interconnects.; Semiconductor lasers.; Printed circuits.; Multichip modules (Microelectronics); Integrated circuits > Very large scale integration.
• Online Access: Abstract with links to resource
• Item Description: Part of : Synthesis digital library of engineering and computer science.; Title from PDF t.p. (viewed on Oct. 27, 2008).; Series from website.
• Physical Description: 1 electronic text (xi, 91 p.) : digital file.; Also available in print.
• Format: Mode of access: World Wide Web.; System requirements: Adobe Acrobat Reader.
• Bibliography: Includes bibliographical references (p. 87-91).
• ISBN: 1598290673 (electronic bk.); 9781598290677 (electronic bk.); 1598290665 (pbk.); 9781598290660 (pbk.)
• ISSN: 1932-1724
• Access: Abstract freely available; full-text restricted to subscribers or individual document purchasers.

This book describes a fully embedded board level optical interconnects in detail including the fabrication of the thin-film VCSEL array, its characterization, thermal management, the fabrication of optical interconnection layer, and the integration of mentioned devices on a flexible waveguide film. All the optical components are buried within electrical PCB layers in a fully embedded board level optical interconnect. Therefore, we can save foot prints on the top real estate of the PCB and relieve packaging difficulty reduced by separating fabrication processes. To realize fully embedded board level optical interconnects, many stumbling blocks need to be addressed such as thin-film transmitter and detector, thermal management, process compatibility, reliability, cost effective fabrication process, and easy integration. The material presented eventually will relieve such concerns and make the integration of optical interconnection highly feasible. The hybrid integration of the optical interconnection layer and electrical layers is ongoing.