The future envelope 2 architecture, climate, skin /

Bibliographic Details
Other Authors: Knaack, Ulrich., Klein, Tillmann.
Format: Electronic
Language:English
Published: Amsterdam : IOS Press, c2009.
Series:Research in architectural engineering series ; v. 9.
Subjects:
Online Access:ebrary
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245 0 4 |a The future envelope 2  |b architecture, climate, skin /  |c edited by Ulrich Knaack & Tillmann Klein.  |h [electronic resource] : 
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246 3 0 |a Architecture, climate, skin 
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500 # # |a Based on the contributions to The Future Envelope symposium held June 5, 2008 in Delft. 
504 # # |a Includes bibliographical references. 
588 # # |a Description based on print version record. 
650 # 0 |a Facades  |v Congresses.  |x Design and construction 
650 # 0 |a Architecture and climate  |v Congresses. 
650 # 7 |a ARCHITECTURE  |x General.  |x Interior Design  |2 bisacsh 
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700 1 # |a Knaack, Ulrich. 
700 1 # |a Klein, Tillmann. 
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