Tribology for Scientists and Engineers From Basics to Advanced Concepts /

• Corporate Author: SpringerLink (Online service)
• Other Authors: Menezes, Pradeep L. (Editor), Nosonovsky, Michael. (Editor), Ingole, Sudeep P. (Editor), Kailas, Satish V. (Editor), Lovell, Michael R. (Editor)
• Format: Electronic
• Language: English
• Published: New York, NY : Springer New York : Imprint: Springer, 2013.
• Subjects: Materials science.; Surfaces (Physics).; Interfaces (Physical sciences).; Thin films.; Machinery.; Tribology.; Corrosion and anti-corrosives.; Coatings.; Materials > Surfaces.; Materials Science.; Tribology, Corrosion and Coatings.; Machinery and Machine Elements.; Surface and Interface Science, Thin Films.; Surfaces and Interfaces, Thin Films.
• Online Access: View fulltext via EzAccess

This book details a comprehensive overview of tribology.  General information on how tribology is approached in various related areas of research, both experimental and computational is provided. The book contains up-to-date data and describes current technologies.

Table of Contents:

• Fundamentals of Engineering Surfaces
• Friction and Wear
• Contact Mechanics
• Experimental Methods in Tribology
• Interface Temperature of Sliding Surfaces
• Tribology of Metals and Alloys
• Tribology of Ceramics and Ceramic Matrix Composites
• Tribology of Metal Matrix Composites
• Coatings Tribology
• Fundamentals of Lubrication
• Self-Lubricating Behaviour of Graphite Reinforced Composites
• Particle Tribology
• Tribology of Solid Lubricants
• Tribology of Green Lubricants
• Nano Tribology
• Surface Probe Techniques
• Biotribology and Human Tribology
• Green and Biomimetic Tribology
• Fundamentals of Linking Tribology and Corrosion for Medical Applications.- Wear of Biomedical Implants
• Tribology in Metal Cutting
• Tribo-chemistry and Tribo-corrosion
• Tribology in Chemical-Mechanical Planarization
• Tribology in Metal Forming
• Tribology in Machine Components
• Macroscale Applications in Tribology
• Microscale Applications in Tribology.