IC Interconnect Analysis
As integrated circuit (IC) feature sizes scaled below a quarter of a micron, thereby defining the deep submicron (DSM) era, there began a gradual shift in the impact on performance due to the metal interconnections among the active circuit components. Once viewed as merely parasitics in terms of the...
Main Authors: | , , |
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Corporate Author: | |
Format: | Electronic |
Language: | English |
Published: |
Boston, MA :
Springer US,
2002.
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Subjects: | |
Online Access: | View fulltext via EzAccess |
Table of Contents:
- The Elmore Delay
- Higher-Order RC(L) Delay Metrics
- Asymptotic Waveform Evaluation
- Moment Generation
- Passive Reduced-Order Multiport Models
- Interfacing with SPICE
- Interfacing Interconnect and Gate-Delay Models.