Design of Adhesive Joints Under Humid Conditions

• Corporate Author: SpringerLink (Online service)
• Other Authors: Silva, Lucas F. M. (Editor), Sato, Chiaki. (Editor)
• Format: Electronic
• Language: English
• Published: Berlin, Heidelberg : Springer Berlin Heidelberg : Imprint: Springer, 2013.
• Series: Advanced Structured Materials, 25
• Subjects: Polymers.; Materials.; Astronautics.; Surfaces (Physics).; Materials Science.; Surfaces and Interfaces, Thin Films.; Continuum Mechanics and Mechanics of Materials.; Polymer Sciences.; Aerospace Technology and Astronautics.
• Online Access: https://ezaccess.library.uitm.edu.my/login?url=http://dx.doi.org/10.1007/978-3-642-37614-6

This book describes most recent advances and limitations concerning design of adhesive joints under humid conditions and discusses future trends. It� presents new approaches to predict the failure load after exposure to load, temperature and humidity over a long period of time. With the rapid increa...

Table of Contents:

• Diffusion of moisture in adhesives
• Diffusion of moisture in interfaces
• Surface treatments for moisture resistance
• Influence of moisture on the adhesive properties
• Influence of water on the interface properties
• Prediction of joint strength under humid conditions: Continuum mechanics approach
• Prediction of joint strength under humid conditions: Fracture mechanics approach
• Prediction of joint strength under humid conditions: Damage mechanics approach.